Search Results for &quot; AT25160B-XHL-T &quot;

16Kbit Serial EEPROM, 2.5-5V, 8-Pin TSSOP, 20MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

AT25160B-XHL-B

16Kbit Serial EEPROM, 2Kx8, 2.5-5V, 8-Pin TSSOP, 20MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

AT25160BN-SH-T

IC EEPROM 16KBIT 20MHZ 8SOIC

Obsolete

Access Time: 80ns

Package/Case: SOIC

Frequency: 20MHz

Interface: SPI, Serial

AT25160B-TH-T

IC EEPROM 16KBIT 20MHZ 8TSSOP

Obsolete

Access Time: 80ns

Package/Case: TSSOP

Frequency: 20MHz

Interface: SPI, Serial

AT25160B-PU

IC EEPROM 16KBIT 20MHZ 8DIP

Obsolete

Access Time: 80ns

Package/Case: PDIP

Frequency: 20MHz

Interface: SPI, Serial

AT25160B-TH-B

IC EEPROM 16KBIT 20MHZ 8TSSOP

Obsolete

Access Time: 80ns

Package/Case: TSSOP

Frequency: 20MHz

Interface: SPI, Serial

AT25160BN-SH-B

IC EEPROM 16KBIT 20MHZ 8SOIC

Obsolete

Access Time: 80ns

Package/Case: SOIC

Frequency: 20MHz

Interface: SPI, Serial

EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8

SOP, SOP8,.25

Transferred

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

AT25160B-W11L

EEPROM Serial-SPI 16K-bit 2K x 8 2.5V/3.3V/5V Die

Die

Unconfirmed

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 16Kbit

AT25160B-CUL-T

16Kbit Serial EEPROM, 2.5-5V, 8-Pin VFBGA, 20MHz

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: VFBGA

Package Description: Very Thin Fine Pitch Ball Grid Array

AT25160B-MEHL-T

16Kbit Serial EEPROM, 2Kx8, 2.5-5V, 8-Pin UDFN, SMT

Non-Lead-Frame SMT

Unconfirmed

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UDFN

Package Description: Micro Dual Flat Package No Lead

AT25160B-MAHL-T

16Kbit Serial EEPROM 3-Wire 2.5-5V 8-Pin UDFN EP SMT

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UDFN EP

Package Description: Micro Dual Flat Package No Lead, Exposed Pad

16Kbit Serial EEPROM, 2Kx8, 2.5-5V, 8-Pin SOIC N, 20MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOIC N

Package Description: Small Outline IC Narrow Body

+27

EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8

SOP, SOP8,.25

Transferred

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

AT25160B-MAHL-E

EEPROM, 2KX8, Serial, CMOS, PDSO8

2 X 3 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

16Kbit Serial EEPROM, 2.5-5V, 8-Pin SOIC N, 20MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOIC N

Package Description: Small Outline IC Narrow Body

AT25160BY6-YH-T

IC EEPROM 16KBIT 20MHZ 8MINIMAP

Obsolete

Access Time: 80ns

Access Time-Max: 80ns

Density: 16Kb

Frequency: 20MHz

+15

AT25160B-WT11L

EEPROM Serial-SPI 16K-bit 2K x 8 2.5V/3.3V/5V Die T/R

Die

Unconfirmed

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 16Kbit

AT25160-10PI-1.8

IC EEPROM 16KBIT 3MHZ 8DIP

Obsolete

Access Time: 500ms

Package/Case: DIP

Frequency: 3MHz

Interface: SPI, Serial

AT25160-10PC-1.8

IC EEPROM 16KBIT 3MHZ 8DIP

Obsolete

Access Time: 500ms

Package/Case: DIP

Frequency: 3MHz

Interface: SPI, Serial

Search Results for "AT25160B-XHL-T"

Filters

AT25160B-XHL-T

16Kbit Serial EEPROM, 2.5-5V, 8-Pin TSSOP, 20MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

AT25160B-XHL-B

16Kbit Serial EEPROM, 2Kx8, 2.5-5V, 8-Pin TSSOP, 20MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

AT25160BN-SH-T

IC EEPROM 16KBIT 20MHZ 8SOIC

Obsolete

Access Time: 80ns

Package/Case: SOIC

Frequency: 20MHz

Interface: SPI, Serial

AT25160B-TH-T

IC EEPROM 16KBIT 20MHZ 8TSSOP

Obsolete

Access Time: 80ns

Package/Case: TSSOP

Frequency: 20MHz

Interface: SPI, Serial

AT25160B-PU

IC EEPROM 16KBIT 20MHZ 8DIP

Obsolete

Access Time: 80ns

Package/Case: PDIP

Frequency: 20MHz

Interface: SPI, Serial

AT25160B-TH-B

IC EEPROM 16KBIT 20MHZ 8TSSOP

Obsolete

Access Time: 80ns

Package/Case: TSSOP

Frequency: 20MHz

Interface: SPI, Serial

AT25160BN-SH-B

IC EEPROM 16KBIT 20MHZ 8SOIC

Obsolete

Access Time: 80ns

Package/Case: SOIC

Frequency: 20MHz

Interface: SPI, Serial

EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8

SOP, SOP8,.25

Transferred

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

AT25160B-W11L

EEPROM Serial-SPI 16K-bit 2K x 8 2.5V/3.3V/5V Die

Die

Unconfirmed

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 16Kbit

AT25160B-CUL-T

16Kbit Serial EEPROM, 2.5-5V, 8-Pin VFBGA, 20MHz

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: VFBGA

Package Description: Very Thin Fine Pitch Ball Grid Array

AT25160B-MEHL-T

16Kbit Serial EEPROM, 2Kx8, 2.5-5V, 8-Pin UDFN, SMT

Non-Lead-Frame SMT

Unconfirmed

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UDFN

Package Description: Micro Dual Flat Package No Lead

AT25160B-MAHL-T

16Kbit Serial EEPROM 3-Wire 2.5-5V 8-Pin UDFN EP SMT

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: DFN

Package/Case: UDFN EP

Package Description: Micro Dual Flat Package No Lead, Exposed Pad

16Kbit Serial EEPROM, 2Kx8, 2.5-5V, 8-Pin SOIC N, 20MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOIC N

Package Description: Small Outline IC Narrow Body

+27

EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8

SOP, SOP8,.25

Transferred

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

AT25160B-MAHL-E

EEPROM, 2KX8, Serial, CMOS, PDSO8

2 X 3 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

16Kbit Serial EEPROM, 2.5-5V, 8-Pin SOIC N, 20MHz

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: SOIC N

Package Description: Small Outline IC Narrow Body

AT25160BY6-YH-T

IC EEPROM 16KBIT 20MHZ 8MINIMAP

Obsolete

Access Time: 80ns

Access Time-Max: 80ns

Density: 16Kb

Frequency: 20MHz

+15

AT25160B-WT11L

EEPROM Serial-SPI 16K-bit 2K x 8 2.5V/3.3V/5V Die T/R

Die

Unconfirmed

Package Family Name: Die

Package/Case: Die

Package Description: An Unpackaged, Fully Tested Integrated Circuit Chip

Density: 16Kbit

AT25160-10PI-1.8

IC EEPROM 16KBIT 3MHZ 8DIP

Obsolete

Access Time: 500ms

Package/Case: DIP

Frequency: 3MHz

Interface: SPI, Serial

AT25160-10PC-1.8

IC EEPROM 16KBIT 3MHZ 8DIP