Search Results for &quot; F1206A0R37FWTR &quot;

FUSE BOARD MNT 375MA 32VDC 1206

Volume Production

Package/Case: 1206

Current Rating: 375mA

DC Cold Resistance: 400mR

Height: 1.2mm

Fuse Chip Fast Acting 0.375A 32V SMD Solder Pad 1206 T/R UL/cUL

1206

Active

Max Operating Temperature: 125

Min Operating Temperature: -55

Fuse Chip 0.375A 32V Fast 2-Pin Solder Pad Surface Mount T/R

Volume Production

Current Rating: 375mA

Height: 1.2mm

Length: 3.1mm

Max Operating Temperature: 125°C

Fuse Chip 0.375A 32V Fast 2-Pin Solder Pad Surface Mount T/R

1206

Active

Current Rating: 0.375A

Type: Chip

Voltage Rating: 32V

Termination Style: Solder Pad

F1206A0R37FSTR

Fuse Chip Fast Acting 0.375A 32V SMD Solder Pad 1206 UL/cUL

1206

Current Rating: 0.375A

Type: Chip

Voltage Rating: 32V

Termination Style: Solder Pad

Search Results for "F1206A0R37FWTR"

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FUSE BOARD MNT 375MA 32VDC 1206

Volume Production

Package/Case: 1206

Current Rating: 375mA

DC Cold Resistance: 400mR

Height: 1.2mm

Fuse Chip Fast Acting 0.375A 32V SMD Solder Pad 1206 T/R UL/cUL

1206

Active

Max Operating Temperature: 125

Min Operating Temperature: -55

Fuse Chip 0.375A 32V Fast 2-Pin Solder Pad Surface Mount T/R

Volume Production

Current Rating: 375mA

Height: 1.2mm

Length: 3.1mm

Max Operating Temperature: 125°C

Fuse Chip 0.375A 32V Fast 2-Pin Solder Pad Surface Mount T/R

1206

Active

Current Rating: 0.375A

Type: Chip

Voltage Rating: 32V

Termination Style: Solder Pad

F1206A0R37FSTR

Fuse Chip Fast Acting 0.375A 32V SMD Solder Pad 1206 UL/cUL