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MCIMX351AVM4BR2

SPECIALTY CONSUMER CIRCUIT

,

Active

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

MCIMX351AVM4BR2

Freescale Semiconductor

i.MX35 32-bit MPU, ARM1136JF-S core, 400MHz, MAPBGA 400

,

Transferred

PCIMX351AVM4BR2

400-Pin MAP-BGA SoC, ARM1136JF-S, 400MHz, 32-bit, 128KB RAM

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

MCIMX355AVM4BR2

Processors - Application Specialized RINGO MX35 TO2

Obsolete

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

MCIMX356AVM4BR2

32-bit ARM Microprocessor, 1.47V, 85°C, LFBGA, RoHS Compliant

Obsolete

Package/Case: LFBGA

Core Architecture: ARM

Data Bus Width: 32b

Halogen Free: Halogen Free

MCIMX355AVM4BR2

Freescale Semiconductor

i.MX35 32-bit MPU, ARM1136JF-S core, 400MHz, MAPBGA 400

,

Obsolete

MCIMX351AVM5BR2

MCIMX351AVM5BR2

Unknown

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Packaging: Tape and Reel

Radiation Hardening: No