PackageLFBGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX355AVM4BR2 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Interface
I2C, SPI, USB, CAN, Ethernet, MMC, UART, USART, EBI/EMI, 1-WIRE
Max Operating Temperature
85°C
Memory Type
ROM, L2 Cache, ROMless,
Min Operating Temperature
-40°C
Max Supply Voltage
1.47V
Mount
Surface Mount
Number of I/Os
96
Oscillator Type
External
Package Quantity
1000
Packaging
Tape and Reel
Peripherals
POR, PWM, WDT, DMA, LCD
Radiation Hardening
No
RAM Size
128KB
RoHS Compliant
Yes
Series
i.MX35
Weight
0.029584oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX355AVM4BR2 Datasheet
Download the complete datasheet for NXP MCIMX355AVM4BR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.