Search Results for &quot; MCIMX353CJQ5C &quot;

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

Freescale Semiconductor

400-Pin PBGA Industrial Microprocessor IC, 17x17mm

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX353CJQ5CR2

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

Search Results for "MCIMX353CJQ5C"

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i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

Freescale Semiconductor

400-Pin PBGA Industrial Microprocessor IC, 17x17mm

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

MCIMX353CJQ5CR2

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, 400-Pin MAP-BGA