Search Results for &quot; MMN80CTC &quot;

Atmel

8-Bit RISC MCU, 20MHz, FLASH, 28-Pin PQCC, Industrial

HVQCCN, LCC28,.16SQ,18

Transferred

Max Operating Temperature: 105

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: QUAD

+23

8-Bit AVR MCU 4KB FLASH 20MHz 23 I/O VQFN

HVQCCN, LCC28,.16SQ,18

Active

Package/Case: VQFN

Contact Plating: Gold

Core Architecture: AVR

Frequency: 20MHz

+21

ATMEGA88PA-MMN

IC MCU 8BIT 8KB FLASH 28VQFN

HVQCCN, LCC28,.16SQ,18

Active

Package/Case: VQFN

Core Architecture: AVR

Frequency: 20MHz

Interface: I2C, SPI, UART, USART

+13

ATMEGA88PA-MMNR

IC MCU 8BIT 8KB FLASH 28VQFN

5592 210 MM X 300 MM 2.0 MM

HVQCCN, LCC28,.16SQ,18

Active

Package/Case: PDIP

Core Architecture: AVR

Data Bus Width: 8b

Interface: I2C, SPI, UART, USART

+15

Thermally Conductive Interface Pads, Gray or Off White

5592 210 MM X 300 MM 1.0 MM

Active

Thermally Conductive Interface Pads, Gray or Off White

5595 210 MM X 300 MM 1.5 MM

Active

Thermally Conductive Interface Pads

5595 210 MM X 300 MM 2.0 MM

Active

Thermally Conductive Interface Pads

5519 210 MM X 155 MM X 1.0 MM

Active

Soft Thermal Interface Pad, 210x155x1.0mm

5519 210 MM X 155 MM X 2.0 MM

Active

Hyper Soft Thermally Conductive Interface Pads

5595 210 MM X 300 MM 1.0 MM

Active

Thermally Conductive Interface Pads

5592 210 MM X 300 MM 1.5 MM

Active

Thermally Conductive Interface Pads, Gray or Off White

5591S 210 MM X 300 MM 2.0 MM

Active

Thermally Conductive Interface Pad

5591S 210 MM X 300 MM 1.0 MM

Active

Thermally Conductive Interface Pad

5591S 210 MM X 300 MM 2.5 MM

Active

Thermally Conductive Interface Pad

5519S 210 MM X 155 MM X 1.5 MM

Active

Hyper Soft Thermally Conductive Interface Pads

5591S 210 MM X 300 MM 1.5 MM

Active

Thermally Conductive Interface Pad

5591S 210 MM X 300 MM 0.5 MM

Obsolete

Thermally Conductive Interface Pad

5519S 210 MM X 155 MM X 0.5 MM

Active

Hyper Soft Thermally Conductive Interface Pads

Standex-Meder Electronics

Active

MMS-B-1

Reed Proximity Sensor

SMD

Obsolete

Package Family Name: SMD

Package/Case: SMD

Package Description: Surface Mount Device

Pin Count: 2

Search Results for "MMN80CTC"

Filters

Atmel

8-Bit RISC MCU, 20MHz, FLASH, 28-Pin PQCC, Industrial

HVQCCN, LCC28,.16SQ,18

Transferred

Max Operating Temperature: 105

Number of Terminals: 28

Min Operating Temperature: -40

Terminal Position: QUAD

+23

8-Bit AVR MCU 4KB FLASH 20MHz 23 I/O VQFN

HVQCCN, LCC28,.16SQ,18

Active

Package/Case: VQFN

Contact Plating: Gold

Core Architecture: AVR

Frequency: 20MHz

+21

ATMEGA88PA-MMN

IC MCU 8BIT 8KB FLASH 28VQFN

HVQCCN, LCC28,.16SQ,18

Active

Package/Case: VQFN

Core Architecture: AVR

Frequency: 20MHz

Interface: I2C, SPI, UART, USART

+13

ATMEGA88PA-MMNR

IC MCU 8BIT 8KB FLASH 28VQFN

5592 210 MM X 300 MM 2.0 MM

HVQCCN, LCC28,.16SQ,18

Active

Package/Case: PDIP

Core Architecture: AVR

Data Bus Width: 8b

Interface: I2C, SPI, UART, USART

+15

Thermally Conductive Interface Pads, Gray or Off White

5592 210 MM X 300 MM 1.0 MM

Active

Thermally Conductive Interface Pads, Gray or Off White

5595 210 MM X 300 MM 1.5 MM

Active

Thermally Conductive Interface Pads

5595 210 MM X 300 MM 2.0 MM

Active

Thermally Conductive Interface Pads

5519 210 MM X 155 MM X 1.0 MM

Active

Soft Thermal Interface Pad, 210x155x1.0mm

5519 210 MM X 155 MM X 2.0 MM

Active

Hyper Soft Thermally Conductive Interface Pads

5595 210 MM X 300 MM 1.0 MM

Active

Thermally Conductive Interface Pads

5592 210 MM X 300 MM 1.5 MM

Active

Thermally Conductive Interface Pads, Gray or Off White

5591S 210 MM X 300 MM 2.0 MM

Active

Thermally Conductive Interface Pad

5591S 210 MM X 300 MM 1.0 MM

Active

Thermally Conductive Interface Pad

5591S 210 MM X 300 MM 2.5 MM

Active

Thermally Conductive Interface Pad

5519S 210 MM X 155 MM X 1.5 MM

Active

Hyper Soft Thermally Conductive Interface Pads

5591S 210 MM X 300 MM 1.5 MM

Active

Thermally Conductive Interface Pad

5591S 210 MM X 300 MM 0.5 MM

Obsolete

Thermally Conductive Interface Pad

5519S 210 MM X 155 MM X 0.5 MM

Active

Hyper Soft Thermally Conductive Interface Pads

Standex-Meder Electronics

Active

MMS-B-1

Reed Proximity Sensor