Search Results for &quot; PCX745BMZFU300LE &quot;

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255

21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255

Obsolete

Package/Case: FCBGA

Core Architecture: PowerPC

Data Bus Width: 32b

Max Frequency: 300MHz

Microchip

IC MPU POWERPC 300MHZ 255BGA

Obsolete

Core Architecture: PowerPC

Max Operating Temperature: 110°C

Min Operating Temperature: -40°C

Mount: Surface Mount

PCX755BMZFU300LE

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

Obsolete

Package/Case: FCBGA

Core Architecture: PowerPC

Data Bus Width: 32b

Max Frequency: 300MHz

PCX745BMZFU350LE

MPU RISC 32-Bit 0.22um 350MHz 2.5V/3.3V 255-Pin FCBGA

Volume Production

Package/Case: FCBGA

Core Architecture: PowerPC

Data Bus Width: 32b

Max Frequency: 350MHz

PC745BMZFU300LE

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255

BGA, BGA255,16X16,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 255

Min Operating Temperature: -55

Terminal Position: BOTTOM

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255

BGA,

Obsolete

Package/Case: FCBGA

Core Architecture: PowerPC

Data Bus Width: 32b

Frequency: 300MHz

Search Results for "PCX745BMZFU300LE"

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PCX745BMZFU300LE

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255

21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255

Obsolete

Package/Case: FCBGA

Core Architecture: PowerPC

Data Bus Width: 32b

Max Frequency: 300MHz

Microchip

IC MPU POWERPC 300MHZ 255BGA

Obsolete

Core Architecture: PowerPC

Max Operating Temperature: 110°C

Min Operating Temperature: -40°C

Mount: Surface Mount

PCX755BMZFU300LE

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

Obsolete

Package/Case: FCBGA

Core Architecture: PowerPC

Data Bus Width: 32b

Max Frequency: 300MHz

PCX745BMZFU350LE

MPU RISC 32-Bit 0.22um 350MHz 2.5V/3.3V 255-Pin FCBGA

Volume Production

Package/Case: FCBGA

Core Architecture: PowerPC

Data Bus Width: 32b

Max Frequency: 350MHz

PC745BMZFU300LE

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255

BGA, BGA255,16X16,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 255

Min Operating Temperature: -55

Terminal Position: BOTTOM

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255