Search Results for &quot; PEB3304EV1.3 &quot;

Analog Telephony Solution 40Kbps 176-Pin LBGA Tray

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

176-Pin LBGA Low-Profile Ball Grid Array IC

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3394EV1.4

Voice and Internet Enhanced Telephony Interface Concept

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

IC CODEC VOIP 176-LBGA

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 400mW

VINETIC Quad 4-Ch Surface Mount Power Device, 85°C, 400mW, LBGA

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 400mW

PEB3324EV1.4-G

Volume Production

Package/Case: LBGA

Data Rate: 40Kbps

Packaging: Tray

Radiation Hardening: No

Analog Telephony Solutions 176-Pin LBGA Tray

Not Recommended for New Design

Package/Case: LBGA

Mount: Surface Mount

Packaging: Tray

Analog Telephony Solutions 176-Pin LBGA

Unknown

Description: Analog Telephony Solutions 176-Pin LBGA

PEB3324EV14GXP

CODEC & SLIC

Not Recommended for New Design

Search Results for "PEB3304EV1.3"

Filters

Analog Telephony Solution 40Kbps 176-Pin LBGA Tray

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

176-Pin LBGA Low-Profile Ball Grid Array IC

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3394EV1.4

Voice and Internet Enhanced Telephony Interface Concept

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

IC CODEC VOIP 176-LBGA

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 400mW

VINETIC Quad 4-Ch Surface Mount Power Device, 85°C, 400mW, LBGA

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 400mW

PEB3324EV1.4-G

Volume Production

Package/Case: LBGA

Data Rate: 40Kbps

Packaging: Tray

Radiation Hardening: No

Analog Telephony Solutions 176-Pin LBGA Tray

Not Recommended for New Design

Package/Case: LBGA

Mount: Surface Mount

Packaging: Tray

Analog Telephony Solutions 176-Pin LBGA

Unknown

Description: Analog Telephony Solutions 176-Pin LBGA

PEB3324EV14GXP

CODEC & SLIC