Search Results for &quot; S29GL512P11FAI010 &quot;

NOR Flash Parallel 3V/3.3V 512Mbit 64M/32M x 8bit/16bit 110ns 64-Pin Fortified BGA Tray

Volume Production

Package/Case: BGA

Density: 512Mb

Interface: Parallel

Max Operating Temperature: 85°C

Flash, 512MX1, 110ns, PBGA64, FBGA-64

LBGA, BGA64,8X8,40

Obsolete

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: BOTTOM

Flash, 512MX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64

LBGA, BGA64,8X8,40

Transferred

Access Time: 110ns

Access Time-Max: 110ns

Package/Case: FBGA

Data Bus Width: 8b

NOR Flash Parallel 3V/3.3V 512Mbit 64M/32M x 8bit/16bit 110ns 64-Pin Fortified BGA Tray

Volume Production

Package/Case: BGA

Density: 512Mb

Interface: Parallel

Max Operating Temperature: 85°C

Flash, 512MX1, 110ns, PDSO56, TSOP-56

HTSSOP, TSSOP56,.8,20

Obsolete

Max Operating Temperature: 85

Number of Terminals: 56

Min Operating Temperature: -40

Terminal Position: DUAL

Flash, 512MX1, 110ns, PBGA64, FBGA-64

LBGA, BGA64,8X8,40

Obsolete

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: BOTTOM

Flash, 512MX1, 110ns, PBGA64, FBGA-64

FBGA-64

Obsolete

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: BOTTOM

NOR Flash Parallel 3V/3.3V 512Mbit 64M/32M x 8bit/16bit 110ns 64-Pin Fortified BGA T/R

Volume Production

Package/Case: BGA

Density: 512Mb

Interface: Parallel

Max Operating Temperature: 85°C

Flash, 512MX1, 110ns, PDSO56, 20 X 14 MM, MO-142EC, TSOP-56

HTSSOP, TSSOP56,.8,20

Transferred

Package/Case: TSOP

Density: 512Mb

Interface: Parallel

Max Operating Temperature: 85°C

Flash, 512MX1, 110ns, PBGA64, FBGA-64

LBGA, BGA64,8X8,40

Obsolete

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: BOTTOM

Search Results for "S29GL512P11FAI010"

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NOR Flash Parallel 3V/3.3V 512Mbit 64M/32M x 8bit/16bit 110ns 64-Pin Fortified BGA Tray

Volume Production

Package/Case: BGA

Density: 512Mb

Interface: Parallel

Max Operating Temperature: 85°C

Flash, 512MX1, 110ns, PBGA64, FBGA-64

LBGA, BGA64,8X8,40

Obsolete

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: BOTTOM

Flash, 512MX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64

LBGA, BGA64,8X8,40

Transferred

Access Time: 110ns

Access Time-Max: 110ns

Package/Case: FBGA

Data Bus Width: 8b

NOR Flash Parallel 3V/3.3V 512Mbit 64M/32M x 8bit/16bit 110ns 64-Pin Fortified BGA Tray

Volume Production

Package/Case: BGA

Density: 512Mb

Interface: Parallel

Max Operating Temperature: 85°C

Flash, 512MX1, 110ns, PDSO56, TSOP-56

HTSSOP, TSSOP56,.8,20

Obsolete

Max Operating Temperature: 85

Number of Terminals: 56

Min Operating Temperature: -40

Terminal Position: DUAL

Flash, 512MX1, 110ns, PBGA64, FBGA-64

LBGA, BGA64,8X8,40

Obsolete

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: BOTTOM

Flash, 512MX1, 110ns, PBGA64, FBGA-64

FBGA-64

Obsolete

Max Operating Temperature: 85

Number of Terminals: 64

Min Operating Temperature: -40

Terminal Position: BOTTOM

NOR Flash Parallel 3V/3.3V 512Mbit 64M/32M x 8bit/16bit 110ns 64-Pin Fortified BGA T/R

Volume Production

Package/Case: BGA

Density: 512Mb

Interface: Parallel

Max Operating Temperature: 85°C

Flash, 512MX1, 110ns, PDSO56, 20 X 14 MM, MO-142EC, TSOP-56

HTSSOP, TSSOP56,.8,20

Transferred

Package/Case: TSOP

Density: 512Mb

Interface: Parallel

Max Operating Temperature: 85°C

Flash, 512MX1, 110ns, PBGA64, FBGA-64