UJA1076ATW5V01J - Electronic Components Search

IC 16-BIT, FLASH, MICROCONTROLLER, PDSO32, 11 X 6.10 MM, 0.65 MM PITCH, GREEN, PLASTIC, MO-153, SOT-549-1, HTSSOP-32, Microcontroller

Datasheet

11 X 6.10 MM, 0.65 MM PITCH, GREEN, PLASTIC, MO-153, SOT-549-1, HTSSOP-32

Active

Max Operating Temperature: 125

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: DUAL

+19

UJA1076ATW/3V3

NXP

IC 16-BIT, FLASH, MICROCONTROLLER, PDSO32, 11 X 6.10 MM, 0.65 MM PITCH, GREEN, PLASTIC, MO-153, SOT-549-1, HTSSOP-32, Microcontroller

Datasheet

11 X 6.10 MM, 0.65 MM PITCH, GREEN, PLASTIC, MO-153, SOT-549-1, HTSSOP-32

Active

Max Operating Temperature: 125

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: DUAL

+19

UJA1076ATW/3V3/WD,

NXP

CAN Normal/Sleep/Standby Automotive 32-Pin HTSSOP EP

Datasheet

Obsolete

Package/Case: SOT-549-1

Data Rate: 1Mbps

Interface: SPI

Max Operating Temperature: 125°C

UJA1076ATW/3V3/WD

NXP

IC 16-BIT, FLASH, MICROCONTROLLER, PDSO32, 11 X 6.10 MM, 0.65 MM PITCH, GREEN, PLASTIC, MO-153, SOT-549-1, HTSSOP-32, Microcontroller

Datasheet

11 X 6.10 MM, 0.65 MM PITCH, GREEN, PLASTIC, MO-153, SOT-549-1, HTSSOP-32

Active

Max Operating Temperature: 125

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: DUAL

+19

UJA1076ATW/3V3,118

NXP

CAN Normal/Sleep/Standby Automotive 32-Pin HTSSOP EP T/R

Datasheet

Volume Production

Package/Case: SOT-549-1

Data Rate: 1Mbps

Interface: SPI

Lead Free: Lead Free

UJA1076ATW/3V3,112

NXP

CAN Normal/Sleep/Standby Automotive 32-Pin HTSSOP EP Bulk

Datasheet

Obsolete

Package/Case: SOT-549-1

Data Rate: 1Mbps

Interface: SPI

Max Operating Temperature: 125°C

UJA1076ATW/5V0/WD

NXP

IC 16-BIT, FLASH, MICROCONTROLLER, PDSO32, 11 X 6.10 MM, 0.65 MM PITCH, GREEN, PLASTIC, MO-153, SOT-549-1, HTSSOP-32, Microcontroller

Datasheet

11 X 6.10 MM, 0.65 MM PITCH, GREEN, PLASTIC, MO-153, SOT-549-1, HTSSOP-32

Active

Max Operating Temperature: 125

Number of Terminals: 32

Min Operating Temperature: -40

Terminal Position: DUAL

+19

UJA1076ATW/5V0/WD,

NXP

CAN Normal/Sleep/Standby Automotive 32-Pin HTSSOP EP

Datasheet

Obsolete

Package/Case: SOT-549-1

Data Rate: 1Mbps

Interface: SPI

Max Operating Temperature: 125°C

UJA1076ATW/5V0WD,1

NXP

HIGH PERFORMANCE SYSTEM BASIS CHIP

Datasheet

Active

Package/Case: SOT-549-1

Data Rate: 1Mbps

Interface: SPI

Lead Free: Lead Free

UJA1076ATW/5V0,118

NXP

CAN Normal/Sleep/Standby Automotive 32-Pin HTSSOP EP T/R

Datasheet

Volume Production

Package/Case: SOT-549-1

Data Rate: 1Mbps

Interface: SPI

Lead Free: Lead Free

+11

UJA1076ATW/3V3WD,1

NXP

UJA1076A - High-speed CAN core system basis chip TSSOP 32-Pin

Datasheet

Active

Package/Case: SOT-549-1

Interface: SPI

Max Operating Temperature: 125°C

Min Operating Temperature: -40°C

UJA1076ATW/5V0,112

NXP

CAN Normal/Sleep/Standby Automotive 32-Pin HTSSOP EP Tube

Datasheet

Obsolete

Package/Case: SOT-549-1

Data Rate: 1Mbps

Interface: SPI

Max Operating Temperature: 125°C

UJA1076TW/3V3

NXP

HIGH PERFORMANCE SYSTEM BASIS CHIP

Datasheet

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

+11

UJA1076TW/3V3/WD,1

NXP

IC SBC CAN HS 3.3V 32HTSSOP

Datasheet

Obsolete

Interface: SPI

Max Supply Voltage: 28V

Min Supply Voltage: 4.5V

Operating Supply Current: 82uA

UJA1076TW/5V0

NXP

HIGH PERFORMANCE SYSTEM BASIS CHIP

Datasheet

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

+11

UJA1076TW/5V0/WD:1

NXP

IC SBC CAN HS 5V 32HTSSOP

Datasheet

End of Life

Interface: SPI

Lead Free: Lead Free

Max Supply Voltage: 28V

Min Supply Voltage: 4.5V

UJA1076TW/3V3/WD

NXP

HIGH PERFORMANCE SYSTEM BASIS CHIP

Datasheet

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

+11

UJA1076TW/5V0/WD

NXP

HIGH PERFORMANCE SYSTEM BASIS CHIP

Datasheet

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: HTSSOP EP

Package Description: Heat Sinked Thin Shrink Small Outline Package, Exposed Pad

+11

UJA1076TW/5V0,112

NXP

IC SBC CAN HS 5V 32HTSSOP

Datasheet

Obsolete

Interface: SPI

Package Quantity: 1100

RoHS Compliant: Yes

UJA1076TW/3V3,112

NXP

IC SBC CAN HS 3.3V 32HTSSOP

Datasheet

Obsolete

Interface: SPI

Package Quantity: 1100

RoHS Compliant: Yes

Search Results for "UJA1076ATW5V01J"

Filters

Search Results for "UJA1076ATW5V01J"

Filters