Wi-Fi and Bluetooth LE MCU module integrates an ESP32-D0WD-V3 dual-core LX6 processor with 4 MB Quad SPI flash and 8 MB Quad SPI PSRAM. The module operates from a 3.0 V to 3.6 V supply and supports 802.11 b/g/n Wi-Fi up to 150 Mbps plus Bluetooth v4.2 BR/EDR and Bluetooth LE. The 18.0 mm × 31.4 mm × 3.3 mm module provides 38 pins, up to 24 GPIOs, an on-board PCB antenna, and a -40 °C to 85 °C ambient operating range. It is rated MSL 3 and carries REACH/RoHS green certification.
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| Embedded chip | ESP32-D0WD-V3 |
| CPU core | Xtensa dual-core 32-bit LX6 |
| Maximum CPU frequency | 240MHz |
| ROM | 448KB |
| SRAM | 520KB |
| RTC SRAM | 16KB |
| Flash memory | 4 Quad SPIMB |
| PSRAM | 8 Quad SPIMB |
| Wi-Fi standard | IEEE 802.11b/g/n |
| Wi-Fi data rate | Up to 150Mbps |
| Wi-Fi operating channel center frequency | 2412 to 2484MHz |
| Bluetooth protocol | Bluetooth v4.2 BR/EDR and Bluetooth LE |
| Bluetooth LE operating channel center frequency | 2402 to 2480MHz |
| Supply voltage | 3.0 to 3.6V |
| External power supply current | 0.5 minA |
| Operating temperature | -40 to 85°C |
| Antenna | On-board PCB antenna |
| GPIO | Up to 24 |
| Pins | 38 |
| Module dimensions | 18.0 × 31.4 × 3.3mm |
| Moisture sensitivity level | MSL 3 |
| ESD HBM rating | ±2000V |
| RoHS | Compliant |
| REACH | Compliant |
| Bluetooth Certification | BQB |
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