Wi-Fi and Bluetooth LE MCU module integrates an ESP32 dual-core LX6 microprocessor with external-antenna connectivity through a compatible miniature RF connector. The module supports 2.4 GHz 802.11 b/g/n Wi-Fi up to 150 Mbps and Bluetooth v4.2 BR/EDR and Bluetooth LE operation. Current ESP32-WROVER-IE series variants use Quad SPI flash options and 8 MB Quad SPI PSRAM, with a 3.0 V to 3.6 V supply range. The 18.0 mm by 31.4 mm module operates from -40 °C to 85 °C and provides up to 24 GPIOs with common serial, PWM, ADC, DAC, touch, and CAN-compatible TWAI interfaces. Green certification includes REACH and RoHS.
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| Series | ESP32-WROVER |
| Processor core | Xtensa dual-core 32-bit LX6 |
| Embedded chip | ESP32-D0WD-V3 or ESP32-D0WDR2-V3 |
| Maximum CPU clock | 240MHz |
| ROM | 448KB |
| SRAM | 520KB |
| RTC SRAM | 16KB |
| SPI flash options | 4, 8, 16MB |
| PSRAM | 8 Quad SPI for current N_R8 variantsMB |
| Wi-Fi protocol | 802.11 b/g/n |
| Wi-Fi frequency range | 2412 to 2484MHz |
| Maximum Wi-Fi data rate | 150Mbps |
| Bluetooth protocol | Bluetooth v4.2 BR/EDR and Bluetooth LE |
| Bluetooth LE frequency range | 2402 to 2480MHz |
| Bluetooth LE transmit power range | -12 to 9dBm |
| GPIO count | Up to 24 |
| Interfaces | SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI |
| Antenna connection | External antenna connector compatible with U.FL, MHF I, and AMC |
| Supply voltage | 3.0 to 3.6V |
| Operating ambient temperature | -40 to 85°C |
| Module dimensions | 18.0 × 31.4 × 3.3mm |
| Pins | 38 |
| Crystal oscillator | 40MHz |
| Green Certification | REACH/RoHS |
| Bluetooth Certification | BQB |
| Rf Certification | Certificates available for ESP32-WROVER-E and ESP32-WROVER-IE |
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