Wi-Fi and Bluetooth LE MCU module integrates an ESP32 dual-core 32-bit LX6 microprocessor with 4 MB SPI flash and an on-board PCB antenna. The module supports 802.11b/g/n Wi-Fi up to 150 Mbps and Bluetooth v4.2 BR/EDR and Bluetooth LE. It operates from a 3.0 V to 3.6 V supply over a -40 °C to 85 °C ambient range. The module provides up to 32 GPIOs and common interfaces including UART, SPI, SDIO, I2C, I2S, PWM, ADC, DAC, touch sensing, and TWAI-compatible CAN. Green certification includes REACH and RoHS.
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| Embedded SoC | ESP32-D0WDQ6 |
| CPU core | Xtensa dual-core 32-bit LX6 |
| Maximum CPU frequency | 240MHz |
| ROM | 448KB |
| SRAM | 520KB |
| RTC SRAM | 8KB |
| SPI flash | 4MB |
| Wi-Fi standard | 802.11b/g/n |
| Wi-Fi maximum bit rate | 150Mbps |
| Operating channel center frequency range | 2412 to 2484MHz |
| Bluetooth specification | Bluetooth v4.2 BR/EDR and Bluetooth LE |
| GPIO count | Up to 32 |
| Antenna | On-board PCB antenna |
| Operating supply voltage | 3.0 to 3.6V |
| Typical supply voltage | 3.3V |
| Operating ambient temperature | -40 to 85°C |
| Module dimensions | 18 × 25.5 × 3.1mm |
| Pin count | 38 |
| Moisture sensitivity level | MSL 3 |
| Bluetooth LE receiver sensitivity | -97 typicaldBm |
| RoHS | Compliant |
| REACH | Compliant |
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