The GS832118GE-133I is a 36Mb dual-port memory device packaged in a flip-chip ball grid array (FBGA). It features a 21-bit address bus and is designed to operate within a temperature range of -40°C to 85°C. The device is available in tray packaging and is compliant with RoHS regulations.
PackageFBGA
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Technical Specifications
GSI GS832118GE-133I technical specifications.
General
| Address Bus Width | 21b |
| Package/Case | FBGA |
| Density | 36Mb |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Ports | 2 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
GSI GS832118GE-133I Datasheet
Download the complete datasheet for GSI GS832118GE-133I to view detailed technical specifications.
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