This 36Mb memory device features a 20-bit address bus width and is packaged in a flip-chip ball grid array (FBGA). It operates within a temperature range of 0°C to 70°C. The device is available in a tray packaging and is compliant with RoHS regulations.
PackageFBGA
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Technical Specifications
GSI GS832236GB-166 technical specifications.
General
| Address Bus Width | 20b |
| Package/Case | FBGA |
| Density | 36Mb |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Number of Ports | 4 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
GSI GS832236GB-166 Datasheet
Download the complete datasheet for GSI GS832236GB-166 to view detailed technical specifications.
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