BERGQUIST SIL PAD TSP Q2000 (formerly known as Q-PAD 3) is a glass-reinforced grease replacement thermal interface material. It is a silicone-based black elastomer with a fiberglass reinforcement carrier designed to eliminate problems associated with thermal grease such as contamination of electronic assemblies. It conforms to surface textures to create an air-free interface and can be installed prior to soldering and cleaning.
Henkel 2166003 technical specifications.
| Thermal Conductivity | 2.0W/(m-K) |
| Thermal Impedance | 0.35 @ 50 psi°C-in2/W |
| Operating Temperature Range | -60 to 180°C |
| Total Thickness | 0.127mm |
| Hardness | 86Shore A |
| Flammability Rating | 94 V-0UL |
| Volume Resistivity | 1x10^2ohm-meter |
| Dielectric Breakdown Voltage | Non-InsulatingVac |
| RoHS | Compliant |
Download the complete datasheet for Henkel 2166003 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.