Hynix
H55S1G22MFP-E3
H55S1G22MFP-E3, SDRAM Memory 1Gbit Surface Mount, 166MHz, 1.7 1.95 V, -30 +85 C, 90-Pin, FBGA
PackageFBGA
MountingSurface Mount
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Technical Specifications
Hynix H55S1G22MFP-E3 technical specifications.
General
| Access Time-Max | 6ns |
| Address Bus Width | 13b |
| Package/Case | FBGA |
| Data Bus Width | 32b |
| Height | 1mm |
| Length | 13mm |
| Max Operating Temperature | 85°C |
| Memory Size | 1Gb |
| Min Operating Temperature | -30°C |
| Max Supply Voltage | 1.95V |
| Min Supply Voltage | 1.7V |
| Mount | Surface Mount |
| Width | 8mm |
Compliance
| RoHS | Compliant |
Datasheet
Hynix H55S1G22MFP-E3 Datasheet
Download the complete datasheet for Hynix H55S1G22MFP-E3 to view detailed technical specifications.
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