High-Density E1 Line Interface Unit 640-Pin BGA
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| Package/Case | BGA |
| Contact Plating | Tin, Lead |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Package Quantity | 5 |
| Packaging | Bulk |
| Radiation Hardening | No |
| RoHS Compliant | No |
| RoHS | Not CompliantNo |
