The IDT 89HPES12T3G2ZABC8 is a PCI Express component packaged in a Lead Ball Grid Array (LBGA) with a surface mount configuration. It has a maximum operating temperature of 70°C and a minimum operating temperature of 0°C. The component is 19mm in length and 19mm in width, with a thickness of 1.4mm. It is available in quantities of 750 per reel and is packaged in tape and reel format. The component is not RoHS compliant and contains lead in its contact plating.
PackageLBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
IDT 89HPES12T3G2ZABC8 technical specifications.
General
| Package/Case | LBGA |
| Contact Plating | Tin, Lead |
| Interface | PCI Express |
| Lead Free | Contains Lead |
| Length | 19mm |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Moisture Sensitivity Level | 3 |
| Mount | Surface Mount |
| Package Quantity | 750 |
| Packaging | Tape and Reel |
| RoHS Compliant | No |
| Series | PRECISE™ |
| Thickness | 1.4mm |
| Width | 19mm |
Compliance
| RoHS | Not Compliant |
Datasheet
IDT 89HPES12T3G2ZABC8 Datasheet
Download the complete datasheet for IDT 89HPES12T3G2ZABC8 to view detailed technical specifications.
No datasheet is available for this part.