The IDT 89HPES12T3G2ZBBC8 is a PCI Express interface component with a lead-free package. It is available in a LBGA package and is designed for surface mount applications. The component operates within a temperature range of 0°C to 70°C. It is not RoHS compliant due to the presence of lead in the contact plating.
PackageLBGA
MountingSurface Mount
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Technical Specifications
IDT 89HPES12T3G2ZBBC8 technical specifications.
General
| Package/Case | LBGA |
| Contact Plating | Tin, Lead |
| Interface | PCI Express |
| Lead Free | Contains Lead |
| Length | 19mm |
| Max Operating Temperature | 70°C |
| Min Operating Temperature | 0°C |
| Moisture Sensitivity Level | 3 |
| Mount | Surface Mount |
| Package Quantity | 750 |
| Packaging | Tape and Reel |
| RoHS Compliant | No |
| Series | PRECISE™ |
| Thickness | 1.4mm |
| Width | 19mm |
Compliance
| RoHS | Not Compliant |
Datasheet
IDT 89HPES12T3G2ZBBC8 Datasheet
Download the complete datasheet for IDT 89HPES12T3G2ZBBC8 to view detailed technical specifications.
No datasheet is available for this part.