N-channel silicon power MOSFET featuring 100V drain-source voltage and 20A continuous drain current. This surface-mount component utilizes DirectFET process technology and is housed in a 15-pin Direct-FET L8 package with no leads. Key electrical characteristics include a maximum drain-source on-resistance of 3.5 mOhm at 10V and a typical gate charge of 200 nC at 10V. Operating temperature range spans from -55°C to 175°C, with a maximum power dissipation of 3300 mW.
PackageDirect-FET L8
MountingSurface Mount
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Technical Specifications
Infineon IRF7769L2TR1PbF technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package/Case | Direct-FET L8 |
| Package Description | Metal Can Direct FET Package |
| Lead Shape | No Lead |
| Pin Count | 15 |
| PCB | 15 |
| Package Length (mm) | 7.1(Max) |
| Package Width (mm) | 9.15(Max) |
| Package Height (mm) | 0.49(Max) |
| Seated Plane Height (mm) | 0.74(Max) |
| Package Material | Copper |
| Mounting | Surface Mount |
| Configuration | Single Hex Drain Octal Source |
| Category | Power MOSFET |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Process Technology | DirectFET |
| Maximum Drain Source Voltage | 100V |
| Maximum Gate Source Voltage | ±20V |
| Maximum Continuous Drain Current | 20A |
| Material | Si |
| Maximum Drain Source Resistance | 3.5@10VmOhm |
| Typical Gate Charge @ Vgs | 200@10VnC |
| Typical Gate Charge @ 10V | 200nC |
| Typical Input Capacitance @ Vds | 11560@25VpF |
| Maximum Power Dissipation | 3300mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 175°C |
Compliance
| Cage Code | CG091 |
| EU RoHS | Yes |
| HTS Code | 8541290095 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Infineon IRF7769L2TR1PbF Datasheet
Download the complete datasheet for Infineon IRF7769L2TR1PbF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.