32-bit TriCore RISC microcontroller featuring a 150 MHz maximum clock rate and 150 MHz maximum CPU frequency. This surface-mount device offers 16KB of ROM program memory and 96KB of RAM. The LBGA package is a low-profile ball grid array with a 208-pin count, 1mm pin pitch, and dimensions of 17mm x 17mm. Operating voltage ranges from 1.58V to 3.47V, with an operating temperature range of -40°C to 85°C. It includes 72 programmable I/Os and interfaces such as ASC, I2C, MLI, and SSC, with 2 I2C channels.
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Infineon SAF-TC1100-L150EB-G technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 208 |
| PCB | 208 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.6(Max) - 0.3(Min) |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | TC11xx |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 150MHz |
| Maximum CPU Frequency | 150MHz |
| Device Core | TriCore |
| Program Memory Type | ROM |
| Program Memory Size | 16KB |
| RAM Size | 96KB |
| Number of Programmable I/Os | 72 |
| Core Architecture | TriCore |
| Programmability | Yes |
| Number of Timers | 7 |
| Interface Type | ASC/I2C/MLI/SSC |
| CAN | 0 |
| I2C | 2 |
| SPI | 0 |
| Ethernet | 0 |
| UART | 0 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.58|3.47V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | CG091 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
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