32-bit TriCore RISC microcontroller featuring a 150 MHz maximum clock rate and 150 MHz maximum CPU frequency. This surface-mount device offers 16KB of ROM program memory and 96KB of RAM. The LBGA package is a low-profile ball grid array with a 208-pin count, 1mm pin pitch, and dimensions of 17mm x 17mm. Operating voltage ranges from 1.58V to 3.47V, with an operating temperature range of -40°C to 85°C. It includes 72 programmable I/Os and interfaces such as ASC, I2C, MLI, and SSC, with 2 I2C channels.
PackageLBGA
MountingSurface Mount
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Technical Specifications
Infineon SAF-TC1100-L150EB-G technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
208
PCB
208
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.6(Max) - 0.3(Min)
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
TC11xx
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
150MHz
Maximum CPU Frequency
150MHz
Device Core
TriCore
Program Memory Type
ROM
Program Memory Size
16KB
RAM Size
96KB
Number of Programmable I/Os
72
Core Architecture
TriCore
Programmability
Yes
Number of Timers
7
Interface Type
ASC/I2C/MLI/SSC
CAN
0
I2C
2
SPI
0
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
1.58|3.47V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
CG091
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Infineon SAF-TC1100-L150EB-G Datasheet
Download the complete datasheet for Infineon SAF-TC1100-L150EB-G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.