PackageDIP
MountingThrough Hole
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Technical Specifications
Infineon TLE4727 technical specifications.
General
Package/Case
DIP
Interface
Parallel
Max Operating Temperature
110°C
Min Operating Temperature
-40°C
Mount
Through Hole
Output Current
800mA
Package Quantity
720
Packaging
Rail/Tube
Radiation Hardening
No
RoHS Compliant
No
Technology
BIPOLAR
Compliance
RoHS
Not CompliantNo
Datasheet
Infineon TLE4727 Datasheet
Download the complete datasheet for Infineon TLE4727 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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