PackageDSO EP
MountingSurface Mount
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Technical Specifications
Infineon TLE8263EXUMA1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
DSO EP
Package Description
Dual Small Outline, Exposed Pad
Lead Shape
Gull-wing
Pin Count
36
PCB
36
Package Length (mm)
12.8
Package Width (mm)
7.6
Package Height (mm)
2.45
Seated Plane Height (mm)
2.55(Max)
Pin Pitch (mm)
0.65
Package Weight (g)
0.59
Package Material
Plastic
Mounting
Surface Mount
Category
System Basis Chip
Maximum Data Rate
1MBd
Max Operating Supply Voltage
28V
Min Operating Supply Voltage
5.5V
Power Supply Type
Analog
Min Operating Temperature
-40°C
Max Operating Temperature
150°C
Typical Operating Supply Voltage
9|12|15|18|24|28V
Compliance
Cage Code
CG091
EU RoHS
Yes
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU
Datasheet
Infineon TLE8263EXUMA1 Datasheet
Download the complete datasheet for Infineon TLE8263EXUMA1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.