16Mbit SDRAM chip, organized as 1Mx16, featuring a 16-bit data bus width and a maximum clock rate of 166 MHz. This DRAM component offers 2 internal banks, each with 512K words, and a 12-bit address bus. Packaged in a 50-pin TSOP-II (Thin Small Outline Package Type II) with gull-wing leads for surface mounting, it operates at a typical 3.3V supply voltage. The component supports a maximum access time of 6 or 5.5 ns and operates within a temperature range of -40°C to 85°C.
Integrated Silicon Solution IS42S16100F-6TLI technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP-II |
| Package Description | Thin Small Outline Package (Type II) |
| Lead Shape | Gull-wing |
| Pin Count | 50 |
| PCB | 50 |
| Package Length (mm) | 21.08(Max) |
| Package Width (mm) | 10.29(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Type | SDRAM |
| Organization | 1Mx16 |
| Data Bus Width | 16bit |
| Maximum Clock Rate | 166MHz |
| Number of Internal Banks | 2 |
| Number of Words per Bank | 512K |
| Maximum Access Time | 6|5.5ns |
| Density in Bits | 16777216bit |
| Address Bus Width | 12bit |
| Maximum Operating Current | 110mA |
| Typical Operating Supply Voltage | 3.3V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Supply Voltage | 3V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 1J9V2 |
| EU RoHS | Yes |
| HTS Code | 8542320002 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Integrated Silicon Solution IS42S16100F-6TLI to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.