16Mbit SDRAM memory chip, organized as 1Mx16, featuring a 16-bit data bus width and a maximum clock rate of 100 MHz. This DRAM component offers 2 internal banks, each with 512K words, and a 12-bit address bus. Packaged in a 50-pin TSOP-II (Thin Small Outline Package Type II) with gull-wing leads for surface mounting, it operates at a typical supply voltage of 1.8V. Dimensions include a maximum package length of 21.08mm, width of 10.29mm, and height of 1.05mm, with a pin pitch of 0.8mm.
PackageTSOP-II
MountingSurface Mount
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Technical Specifications
Integrated Silicon Solution IS42VS16100F-10TL technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-II
Package Description
Thin Small Outline Package (Type II)
Lead Shape
Gull-wing
Pin Count
50
PCB
50
Package Length (mm)
21.08(Max)
Package Width (mm)
10.29(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
16Mbit
Type
SDRAM
Organization
1Mx16
Data Bus Width
16bit
Maximum Clock Rate
100MHz
Number of Internal Banks
2
Number of Words per Bank
512K
Maximum Access Time
8|7ns
Density in Bits
16777216bit
Address Bus Width
12bit
Maximum Operating Current
50mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.9V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
1J9V2
EU RoHS
Yes
HTS Code
8542320002
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Integrated Silicon Solution IS42VS16100F-10TL Datasheet
Download the complete datasheet for Integrated Silicon Solution IS42VS16100F-10TL to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.