Integrated Silicon Solution
IS61NVP102418-200B3I
ZBT SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, TFBGA-165
Quick Jump:
Technical Specifications
Integrated Silicon Solution IS61NVP102418-200B3I technical specifications.
General
| Max Operating Temperature | 85 |
| Number of Terminals | 165 |
| Min Operating Temperature | -40 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | R-PBGA-B165 |
| Width | 13 |
| Length | 15 |
| Pin Count | 165 |
| Number of Functions | 1 |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Nom (Vsup) | 2.5 |
| Supply Voltage-Max (Vsup) | 2.625 |
| Supply Voltage-Min (Vsup) | 2.375 |
| Supply Current-Max | 0.475 |
| Number of Words | 1048576 |
| Number of Words Code | 1000000 |
| Memory IC Type | ZBT SRAM |
| Parallel/Serial | PARALLEL |
| Standby Current-Max | 0.075 |
| Access Time-Max | 3.1 |
| Clock Frequency-Max (fCLK) | 200 |
| I/O Type | COMMON |
Compliance
| RoHS | No |
| Eccn Code | 3A991.B.2.A |
| Lead Free | No |
| HTS Code | 8542.32.00.41 |
| REACH | Compliant |
| Military Spec | False |
Datasheet
Integrated Silicon Solution IS61NVP102418-200B3I Datasheet
Download the complete datasheet for Integrated Silicon Solution IS61NVP102418-200B3I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.