Integrated Silicon Solution
IS61QDB21M18A-300M3LI
QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165
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Technical Specifications
Integrated Silicon Solution IS61QDB21M18A-300M3LI technical specifications.
General
| Max Operating Temperature | 85 |
| Number of Terminals | 165 |
| Min Operating Temperature | -40 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | R-PBGA-B165 |
| Width | 15 |
| Length | 17 |
| Pin Count | 165 |
| Number of Functions | 1 |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Nom (Vsup) | 1.8 |
| Supply Voltage-Max (Vsup) | 1.89 |
| Supply Voltage-Min (Vsup) | 1.71 |
| Supply Current-Max | 1.05 |
| Number of Words | 1048576 |
| Number of Words Code | 1000000 |
| Memory IC Type | QDR SRAM |
| Parallel/Serial | PARALLEL |
| Standby Current-Max | 0.28 |
| Access Time-Max | 0.45 |
| Clock Frequency-Max (fCLK) | 300 |
| I/O Type | SEPARATE |
Compliance
| RoHS | Yes |
| Eccn Code | 3A991.B.2.A |
| Lead Free | Yes |
| HTS Code | 8542.32.00.41 |
| REACH | Compliant |
| Military Spec | False |
Datasheet
Integrated Silicon Solution IS61QDB21M18A-300M3LI Datasheet
Download the complete datasheet for Integrated Silicon Solution IS61QDB21M18A-300M3LI to view detailed technical specifications.
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