Integrated Silicon Solution
IS61QDB42M18A-333M3LI
QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165
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Technical Specifications
Integrated Silicon Solution IS61QDB42M18A-333M3LI technical specifications.
General
Max Operating Temperature
85
Number of Terminals
165
Min Operating Temperature
-40
Terminal Position
BOTTOM
JEDEC Package Code
R-PBGA-B165
Width
15
Length
17
Pin Count
165
Number of Functions
1
Temperature Grade
INDUSTRIAL
Supply Voltage-Nom (Vsup)
1.8
Supply Voltage-Max (Vsup)
1.89
Supply Voltage-Min (Vsup)
1.71
Supply Current-Max
0.75
Number of Words
2097152
Number of Words Code
2000000
Memory IC Type
QDR SRAM
Parallel/Serial
PARALLEL
Standby Current-Max
0.29
Access Time-Max
0.45
Clock Frequency-Max (fCLK)
333
I/O Type
SEPARATE
Compliance
RoHS
Yes
Eccn Code
3A991.B.2.A
HTS Code
8542.32.00.41
REACH
Compliant
Military Spec
False
Datasheet
Integrated Silicon Solution IS61QDB42M18A-333M3LI Datasheet
Download the complete datasheet for Integrated Silicon Solution IS61QDB42M18A-333M3LI to view detailed technical specifications.
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