Field Programmable Gate Array (FPGA) with 300,000 logic cells and 28nm process technology. Features 1152 pins in a 35x35mm Flip Chip Fine Pitch Ball Grid Array (FC-FBGA) package for surface mounting. Offers 544 user I/Os, 15100 Kbit RAM, 920 dedicated DSP blocks, and 1840 multipliers. Supports multiple external memory interfaces including DDR2, DDR3, and LPDDR2 SDRAM. Includes 2 Ethernet MACs, 2 PCI blocks, and 24 transceiver blocks operating at up to 6.5536 Gbps.
PackageFC-FBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Intel 5AGXFB1H4F35C5N technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FC-FBGA
Package Description
Flip Chip Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
1152
PCB
1152
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
2
Seated Plane Height (mm)
2.5
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAR-1
Family Name
Arria® V GX
Maximum Number of User I/Os
544
RAM Bits
15100Kbit
Device Logic Cells
300000
Process Technology
28nm
Ethernet MACs
2
Number of Multipliers
1840 (18x19)
Programmability
Yes
Transceiver Blocks
24
Transceiver Speed
6.5536Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
920
PCI Blocks
2
Speed Grade
5
Differential I/O Standards Supported
LVPECL|LVDS
Single-Ended I/O Standards Supported
LVTTL|LVCMOS
External Memory Interface
DDR2 SDRAM|DDR3 SDRAM|LPDDR2 SDRAM|RLDRAM II|QDRII+SRAM
Device Number of DLLs/PLLs
12
Total Number of Block RAM
1510
Compliance
Cage Code
4BA62
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A001.a.7.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel 5AGXFB1H4F35C5N Datasheet
Download the complete datasheet for Intel 5AGXFB1H4F35C5N to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.