5SGXEA3K1F40C2N

Field Programmable Gate Array (FPGA) with 340,000 logic cells and 513,000 registers, built on 28nm process technology. Features 1517 pins in a 40x40mm Flip Chip Fine Pitch Ball Grid Array (FC-FBGA) package for surface mounting. Offers 696 user I/Os, 19.456 Mbit RAM, 512 18x18 multipliers, 2 Ethernet MACs, 36 transceiver blocks operating at 14.1 Gbps, and 256 dedicated DSP blocks. Supports various I/O standards including LVPECL, LVDS, HCSL, LVTTL, and LVCMOS, with external memory interfaces for DDR2/DDR3 SDRAM, RLDRAM II/III, and QDRII+SRAM. Operates within a 0°C to 85°C temperature range.