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Technical Specifications
Intel ABM-P PXF 4336 V1.1 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 456 |
| PCB | 456 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 2.3 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Traffic Class | ABR|CBR|GFR|UBR|UBR+|nrt-VBR|rt-VBR |
| UTOPIA Type | Level 1|Level 2 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Min Operating Supply Voltage | 1.62|3V |
| Max Operating Supply Voltage | 1.98|3.6V |
| Typical Operating Supply Voltage | 1.8|3.3V |
Compliance
| Cage Code | 4BA62 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Intel ABM-P PXF 4336 V1.1 Datasheet
Download the complete datasheet for Intel ABM-P PXF 4336 V1.1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.