64-bit, 45nm, 2.66GHz microprocessor featuring 4 CPU cores. This Flip-Chip Land Grid Array (FCLGA) package offers a 1366-pin surface mount configuration with no leads. The FCLGA package measures a maximum of 37.55mm in length and width, and 4.24mm in height.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel AT80601000741AB SLBEW technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
1366
PCB
1366
Package Length (mm)
37.55(Max)
Package Width (mm)
37.55(Max)
Package Height (mm)
4.24(Max)
Mounting
Surface Mount
Family Name
Xeon® Processor W3520
Data Bus Width
64bit
Maximum Speed
2660MHz
Process Technology
45nm
Number of CPU Cores
4
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.1
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel AT80601000741AB SLBEW Datasheet
Download the complete datasheet for Intel AT80601000741AB SLBEW to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.