PackagePGA
MountingThrough Hole
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Technical Specifications
Intel AW80576GH0836MGS LGEE technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
PGA
Package/Case
PGA
Package Description
Plastic Pin Grid Array
Lead Shape
Through Hole
Pin Count
478
PCB
478
Package Length (mm)
35
Package Width (mm)
35
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Through Hole
Family Name
Core™2 Duo Processor
Data Bus Width
64bit
Instruction Set Architecture
RISC
Device Core
Core 2 Duo
Maximum Speed
3060MHz
Process Technology
45nm
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.1
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Intel AW80576GH0836MGS LGEE Datasheet
Download the complete datasheet for Intel AW80576GH0836MGS LGEE to view detailed technical specifications.
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