High-performance 64-bit RISC microprocessor featuring 8 CPU cores and a maximum speed of 3.1GHz. Built on 32nm process technology, this Flip-Chip Land Grid Array (FCLGA) package offers 2011 pins for surface mounting. The FCLGA package measures 52.5mm x 45mm and operates at a maximum supply voltage of 1.35V.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel BX80621E52687W SR0KG technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LGA |
| Package/Case | FCLGA |
| Package Description | Flip-Chip Land Grid Array |
| Lead Shape | No Lead |
| Pin Count | 2011 |
| PCB | 2011 |
| Package Length (mm) | 52.5 |
| Package Width (mm) | 45 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Xeon® Processor E5-2687W |
| Data Bus Width | 64bit |
| Instruction Set Architecture | RISC |
| Device Core | Xeon |
| Maximum Speed | 3100MHz |
| Process Technology | 32nm |
| Number of CPU Cores | 8 |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.35V |
| Multiply Accumulate | No |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992.c |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Intel BX80621E52687W SR0KG Datasheet
Download the complete datasheet for Intel BX80621E52687W SR0KG to view detailed technical specifications.
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