64-bit RISC microprocessor featuring a 22nm process technology and a maximum speed of 3.4GHz. This Flip-Chip Land Grid Array (FCLGA) package, with 1155 pins and a 37.5mm x 37.5mm footprint, supports surface mounting. It boasts 4 CPU cores, a 32KB instruction cache, and a 32KB data cache, operating at a maximum supply voltage of 1.52V.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel BX80637I73770 SR0PK technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
1155
PCB
1155
Package Length (mm)
37.5
Package Width (mm)
37.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
Core™ i7-3770 Processor
Data Bus Width
64bit
Instruction Set Architecture
RISC
Device Core
Core i7
Maximum Speed
3400MHz
Process Technology
22nm
Core Architecture
i7
Number of CPU Cores
4
Interface Type
DMI/PECI
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.52V
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992.c
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel BX80637I73770 SR0PK Datasheet
Download the complete datasheet for Intel BX80637I73770 SR0PK to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.