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Technical Specifications
Intel EASY 22558 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.5(Max) - 0.3(Min)
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
4BA62
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Datasheet
Intel EASY 22558 Datasheet
Download the complete datasheet for Intel EASY 22558 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.