
Field-Programmable Gate Array (FPGA) with 100,448 logic cells and 4.347 Mbit of RAM, built on 65nm process technology. Features 276 18x18 multipliers and 4 DLLs/PLLs. Supports up to 278 user I/Os with extensive single-ended and differential I/O standards including LVTTL, LVCMOS, LVPECL, and LVDS. Offers external memory interfaces for DDR2 SDRAM and QDRII+ SRAM. Packaged in a 484-pin FBGA (Fine Pitch Ball Grid Array) for surface mounting, operating within a temperature range of -40°C to 100°C.
Intel EP3CLS100F484I8ES technical specifications.
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