
Field Programmable Gate Array (FPGA) featuring 49,888 logic cells and 2502 Kbit of RAM. This device utilizes 60nm process technology and offers 310 maximum user I/Os. It includes 2 Ethernet MACs, 140 multipliers (18x18), and 8 transceiver blocks operating at 3.125 Gbps. The FPGA supports various I/O standards including B-LVDS, HSTL, LVPECL, LVTTL, and LVCMOS, along with external memory interfaces for DDR2 SDRAM and QDRII+ SRAM. Packaged in a 672-pin Fine Pitch Ball Grid Array (FBGA) measuring 27x27mm, it is designed for surface mounting and operates within a temperature range of -40°C to 100°C.
Intel EP4CGX50CF27I7ES technical specifications.
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