
Field Programmable Gate Array (FPGA) with 49888 logic cells and 2502 Kbit RAM. This device utilizes 60nm process technology and offers 310 maximum user I/Os. Features include 2 Ethernet MACs, 140 (18x18) multipliers, and 8 transceiver blocks operating at 3.125 Gbps. The 672-pin Fine Pitch Ball Grid Array (FBGA) package is surface mountable and designed for a 0 °C to 85 °C operating temperature range.
Intel EP4CGX50DF27C8ES technical specifications.
Download the complete datasheet for Intel EP4CGX50DF27C8ES to view detailed technical specifications.
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