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Technical Specifications
Intel FM1010-F1232-400E-G technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
1232
PCB
1232
Package Length (mm)
45
Package Width (mm)
45
Package Height (mm)
2.97
Seated Plane Height (mm)
3.47
Package Material
Plastic
Mounting
Surface Mount
Min Operating Temperature
-20°C
Max Operating Temperature
85°C
Category
Six Interface System
Compliance
Cage Code
4BA62
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Intel FM1010-F1232-400E-G Datasheet
Download the complete datasheet for Intel FM1010-F1232-400E-G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.