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Technical Specifications
Intel L-TMXF846221BL-3-DB technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 700 |
| PCB | 700 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Rate | 155|622Mbps |
| Category | DS3/E3/DS2/DS1/DS0/E1 SONET/SDH |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Min Operating Supply Voltage | 1.4|3.14V |
| Max Operating Supply Voltage | 1.6|3.47V |
| Typical Operating Supply Voltage | 1.5|3.3V |
Compliance
| Cage Code | 4BA62 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
Datasheet
Intel L-TMXF846221BL-3-DB Datasheet
Download the complete datasheet for Intel L-TMXF846221BL-3-DB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.