Single-chip Ethernet controller supporting 10Mbps, 100Mbps, and 1000Mbps speeds over 10BASE-T, 100BASE-TX, and 1000BASE-T physical networks. Features PCIe host interface, auto-negotiation, DMA support, and full/half duplex communication modes, adhering to IEEE 802.3 standards. Housed in a 256-pin, 17mm x 17mm x 1.41mm Ball Grid Array (BGA) package with a 1mm pin pitch, suitable for surface mounting. Operates within a 3V to 3.6V supply voltage range, with a typical of 3.3V, and functions across an ambient temperature range of -10°C to 85°C. Includes external and internal loopback modes.
PackageBGA
MountingSurface Mount
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Technical Specifications
Intel NHI350AM2 SLJ3S technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.41
Seated Plane Height (mm)
1.81
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-192
Physical Network Type
10BASE-T|100BASE-TX|1000BASE-T
Category
Single Chip
Ethernet Speed
10|100|1000Mbps
Host Interface
PCIe
Auto-Negotiation
Yes
Standard Supported
IEEE 802.3
DMA Support
Yes
Communication Mode
Full Duplex|Half Duplex
Min Operating Temperature
-10°C
Max Operating Temperature
85°C
Loopback Mode
External|Internal
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A991.b.4.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel NHI350AM2 SLJ3S Datasheet
Download the complete datasheet for Intel NHI350AM2 SLJ3S to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.