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Technical Specifications
Intel PEB 2075-P technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
28
PCB
28
Package Length (mm)
35.9
Package Width (mm)
14
Package Height (mm)
4
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-011AB
Data Rate
4000Kbps
Protocols Supported
HDLC
Min Operating Supply Voltage
4.75V
Max Operating Supply Voltage
5.25V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Typical Operating Supply Voltage
5V
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PEB 2075-P Datasheet
Download the complete datasheet for Intel PEB 2075-P to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.