80-pin MQFP surface mount interface IC supporting E1, J1, and T1 framing formats. Features a 0.65mm pin pitch and a 14mm x 14mm x 2mm metric quad flat package with gull-wing leads. Operates from a 4.75V to 5.25V supply, with a maximum data rate of 2.048Mbps. Suitable for applications requiring analog and digital power supply types, with an operating temperature range of -40°C to 85°C.
PackageMQFP
MountingSurface Mount
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Technical Specifications
Intel PEB 2255 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
MQFP
Package Description
Metric Quad Flat Package
Lead Shape
Gull-wing
Pin Count
80
PCB
80
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
2
Seated Plane Height (mm)
2.4(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-108BE-1
Standard Framing Format
E1|J1|T1
Maximum Data Rate
2.048Mbps
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Power Supply Type
Analog|Digital
Min Operating Supply Voltage
4.75V
Max Operating Supply Voltage
5.25V
Maximum Supply Current
85|165mA
Typical Operating Supply Voltage
5V
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Intel PEB 2255 Datasheet
Download the complete datasheet for Intel PEB 2255 to view detailed technical specifications.
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