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Technical Specifications
Intel PEB 3324 E technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
176
PCB
176
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.5(Max) - 0.3(Min)
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Category
Analog Telephony Solution
Maximum Data Rate
40Kbps
Transmission Media Type
Cable
Power Supply Type
Analog
Compliance
Cage Code
4BA62
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PEB 3324 E Datasheet
Download the complete datasheet for Intel PEB 3324 E to view detailed technical specifications.
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