PackageBGA
MountingSurface Mount
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Technical Specifications
Intel PEB20256EV22GXP technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
388
PCB
388
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
1.84(Max)
Seated Plane Height (mm)
2.54(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Category
Multichannel Network Interface Controller
Maximum Data Rate
90Mbps
Max Operating Supply Voltage
2.75|3.6V
Min Operating Supply Voltage
2.25|3V
Power Supply Type
Analog
Typical Supply Current
200(Max)|350(Max)mA
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Typical Operating Supply Voltage
2.5|3.3V
Compliance
Cage Code
4BA62
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PEB20256EV22GXP Datasheet
Download the complete datasheet for Intel PEB20256EV22GXP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.