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Technical Specifications
Intel PEB2256EV1.2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
81
PCB
81
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.5(Max) - 0.3(Min)
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
1
Mounting
Surface Mount
Standard Framing Format
E1|J1|T1
Number of Transceivers
1
Maximum Data Rate
2.048Mbps
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Power Supply Type
Analog|Digital
Min Operating Supply Voltage
3.13V
Max Operating Supply Voltage
3.46V
Maximum Supply Current
90|145mA
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PEB2256EV1.2 Datasheet
Download the complete datasheet for Intel PEB2256EV1.2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.