2-channel specialized interface IC for surface mount applications. Features a 64-pin TQFP package with 0.5mm pin pitch, measuring 10x10x1.4mm. Operates with a 3.3V supply voltage (3.135V to 3.465V) and offers 60dB longitudinal balance. Includes on-chip ring relay driver, on-hook transmission, and polarity reversal capabilities. Suitable for -40°C to 85°C operating temperatures.
PackageTQFP
MountingSurface Mount
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Technical Specifications
Intel PEB3265FV1.5 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
64
PCB
64
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BCD
Number of Channels per Chip
2
On-Chip Ring Relay Driver
Yes
On-Hook Transmission
Yes
Longitudinal Balanced
60(Min)dB
Polarity Reversal
Yes
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
3.465V
Min Operating Supply Voltage
3.135V
Typical Supply Current
70mA
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PEB3265FV1.5 Datasheet
Download the complete datasheet for Intel PEB3265FV1.5 to view detailed technical specifications.
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