PackageBGA
MountingSurface Mount
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Technical Specifications
Intel PEB3456EV2.1 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
388
PCB
388
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
1.66
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Standard Framing Format
DS2|DS3|E1|M12|M13|M23|T1|T3
Maximum Data Rate
2.048Mbps
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Power Supply Type
Analog
Min Operating Supply Voltage
2.25|3V
Max Operating Supply Voltage
2.75|3.6V
Maximum Supply Current
200|400mA
Typical Operating Supply Voltage
2.5|3.3V
Compliance
Cage Code
4BA62
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel PEB3456EV2.1 Datasheet
Download the complete datasheet for Intel PEB3456EV2.1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.